.
1. Ts'ebetso eohle e tlas'a taolo e thata ea boleng.
2. Lisebelisoa tsa li-wipers ke 100% polyester e telele fiber.
3. Ka ho monya ho hoholo, khanyetso e phahameng ea abrasion, bonolo.
4. Li-wiper tsa kamore e le 'ngoe le li-wiper tse hloekileng tsa kamore e tlase
5.Seha le ho tiisoa ka laser kapa ultrasonic, e hlatsoitsoeng le ho omisoa.
6. Bokhoni bo phahameng ba ho hlakola sebakeng se metsi
7. E nkehang habonolo le e loketseng pop-up packing
1. Ultra low mote ho boloka nako e ngata ea ho hloekisa.
2. Ho monya ho boloka tšobotsi e omileng le e metsi.
3. Pampiri e ntle haholo e sireletsang ntho e ka holimo ho scuffing.
4. Hula ka bonngoe ho qoba tšilafalo le ho laola boleng ba tšebeliso.
Mohala oa tlhahiso ea 1.semiconductor, li-chips, microprocessor ect.
2. semiconductor ho kopanya line .
3.disk driver, lisebelisoa tse kopantsoeng
4.LCD lihlahisoa tsa disply
Mohala oa tlhahiso ea 5.SMT.
6. lisebelisoa tse nepahetseng
Lihlahisoa tsa 7.optical
8.indasteri ea lifofane
Lihlahisoa tsa 9.PCB
10.Mehaho ea bongaka
11.Laboratori
12.clean kamoreng le line tlhahiso, thepa
Lipehelo tsa tefo: 30% deposit, 70% pele ho romelloa;
Mehlala: Lisampole tsa mahala lia fumaneha, tefo e bokellang thepa
Nako ea ho tsamaisa: 7-10days
MOQ: 10cartons, theko e itšetlehile ka bongata.
Boema-kepe ba ho tloha: Shanghai China